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Title: KABEG, Konsolidierung der Chipkartensysteme

Description:

Lieferung, Montage, Implementierung und Service für alle Hard- und Softwarekomponenten der Chipkartensysteme in allen Häusern der KABEG

Type of tender:

Key data for the publication of contracts to be awarded, framework agreements and the establishment or phasing-in of dynamic purchasing systems (Annex VIII, Section 1, Z 2 BVergG 2018)

Published on:

6/14/2019

Document number:

KDX681114-2019
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